Routine testing and banding of large volumes of components, development of test methodologies for components in harsh environments, detailed measurements and failure analysis on suspect and failed components, are all within our portfolio of services.

Typical jobs we have carried out for clients are:

• Failure Analysis.
• Cherry Picking and Banding
• Tolerance Checking
• Accelerated testing
• Manufacturing process analysis

We have also been involved in research into new component technologies for harsh environments such as the automotive, aerospace and petroleum industries.

We are often called upon to look at board and assembly problems. Recent jobs have included:

• Examination of cracking of component leads
• Surface mount soldering problems in imported boards
• Fault tracing
• Leadframe fracture during manufacturing
• Solder materials and processes

Through our links with the local universities, we have access to all the latest analytical tools, including SEM, TEM, AFM, SAM, MFX-ray etc.

We are able to develop test systems for special test applications.

Examples of projects that have been undertaken are:

• High temperature testing of passive components - We developed a system to carry out detailed testing of batches of passive components (resistors, capacitors, inductors and circulators) in harsh environments.
• We have developed a test methodology for detecting fuses that are liable to premature failure.

We would be happy to talk to you about your requirements for specialist test.

• We can provide a number of services in Semiconductor Test through the Semiconductor Test Network (SETNET) which we coordinate
  
• In a number of projects we have been involved in high temperature testing of semiconductors (up to 320 C)